Single Z-type SMT Male Pin Header

• Selecting from our ready-made specifications ensures zero tooling costs and the fastest delivery time. Custom sizes are available but will incur additional setup fees and extended lead times.

What are the Single Z-type SMT Male Pin Headers widely used for?

Z-type SMT pin headers are utilized when standard L-type or vertical pins cannot meet specific PCB-to-PCB offset requirements. They are frequently used in Multi-layer Board Stacking to bridge offset components and in LED Lighting Modules for precise positioning. Their symmetrical design is ideal for Automotive Electronics and High-density Communication Equipment where secure, dual-angled signal paths are necessary to navigate complex internal geometries.

Q1: What is the primary advantage of a double right-angle (Z-type) bend over a single L-type bend? 

A: The Z-type configuration provides a specific lateral offset while maintaining a parallel orientation between the starting and ending points of the pin. This geometry is crucial for connecting two parallel PCBs that are slightly misaligned or for elevating a connection above other surface-mounted components.

Q2: How does the symmetry of the 11320083 model simplify automated PCB design? 

A: With symmetrical L and H dimensions (both 5.97mm), the 11320083 model offers a balanced footprint. This symmetry reduces orientation errors during automated pick-and-place processes and provides consistent electrical characteristics across the bend.

Q3: Is the C5191/CuSn6 material capable of withstanding the stresses of the double-bending process? 

A: Yes, C5191 (Phosphor Bronze) is specifically chosen for its exceptional ductility and fatigue resistance. It can undergo two separate 90-degree bends without developing micro-cracks, ensuring the pin remains structurally sound throughout its service life.

Q4: How does the Gold coating over Nickel enhance the performance of Z-type headers in industrial environments? 

A: The Gold layer provides a non-reactive contact surface that prevents oxidation even in harsh, humid environments. The underlying Nickel layer acts as a barrier to prevent copper migration, ensuring solder joints remain strong and electrical contact remains stable.

Q5: What are the packaging specifications for high-volume Z-type header orders? 

A: To ensure compatibility with high-speed SMD assembly lines, these headers are provided in tape and reel packaging with 1600 pieces per reel. This format protects the precise 90°±1° bend angles during shipping and allows for immediate integration into automated workflows.